1.6T OSFP224 ACxxx Active DAC Cable

The 1.6T OSFP224 ACxxx Active DAC Cable provides a 1600Gbps copper connection between OSFP (IHS/Finned Top) to OSFP (IHS/Finned Top) ports with a cable length of customized length. Active electronics inside the connectors extend the usable reach compared with passive copper while keeping power draw low. Direct attach copper keeps both latency and power consumption to a minimum, which makes it the economical choice for 1.6T Ethernet data centers, HPC and machine learning clusters.

Product Highlights

• OSFP (IHS/Finned Top) to OSFP (IHS/Finned Top)
• Data rate: 1600Gbps
• Cable type: Active DAC (ACC)
• Operating temperature: 0 to 70°C (32 to 158°F)

In 1.6T Ethernet data centers, HPC and machine learning clusters, the 1.6T OSFP224 ACxxx Active DAC Cable provides a factory terminated 1600Gbps link between OSFP (IHS/Finned Top) to OSFP (IHS/Finned Top) ports. The integrated construction removes separate optics from the link budget and reduces the number of failure points in the row. Custom labeling, packaging and compatibility coding for specific equipment vendors are available from our factory on request. The link runs 8x 200G-PAM4 to 8x 200G-PAM4 modulation, which keeps it aligned with current 1.6T switch silicon.

Compliance: OSFP Rev 5.2, IEEE 802.3df, IEEE 802.3dj, CMIS 5.0. Every unit's EEPROM coding and link behavior are verified on real host equipment in our lab, so what arrives at your site is ready to use.

This model is supplied at standard length under part number OSFP-1.6T-ACxxx. Other lengths of the same assembly can be produced on request.

Our warehouse keeps fast-moving transceivers and cables ready for same-week dispatch. Courier, air freight and sea freight options are all available depending on your budget and schedule, and we consolidate multiple items into one shipment whenever it saves you cost.

From incoming component inspection to final burn-in, quality is controlled at each step of production. Finished units are verified on real networking equipment in our compatibility lab, and test records are kept per batch so that any field question can be traced back quickly.

Each unit is sealed in an anti-static bag, cushioned in a blister tray and boxed in an export-grade carton. Outer cartons carry handling marks and can be palletized for air or sea freight. If your project requires retail boxes, barcodes or your own brand on the label, we can arrange that as well.

Our product line has grown with the industry for three decades, from GBIC-era modules to today's 800G and 1.6T interconnects. If the exact configuration you need is not listed, we can usually build it: custom lengths, mixed connector breakouts, OEM branding and project-specific firmware coding are all supported.