NVIDIA/Mellanox OSFP800-XDR8-B2 Compatible 800G Twin-port OSFP IHS/Closed Finned Top Transceiver Module

Built for hosts that recognize OSFP800-XDR8-B2, this HT-manufactured Twin-port OSFP IHS/Closed Finned Top module delivers 800G transmission. The design provides wavelength 1310nm, reach 2km and connects through Dual MPO-12/APC through SMF.

OEM Part Number: OSFP800-XDR8-B2HT Part Number: OSFP800-XDR8-B2

Product Highlights

• Compatible alternative to NVIDIA/Mellanox OSFP800-XDR8-B2
• 800G connectivity at 850Gbps (8x 106.25Gbps)
• Optical wavelength: 1310nm
• Specified reach: 2km
• Dual MPO-12/APC / SMF interface
• Digital diagnostic monitoring: Supported
• Operating temperature: 0 to 70°C (32 to 158°F)

Use this module for equipment interconnection over the specified single-mode fiber plant, including enterprise backbone, campus, metro or data-center interconnect links according to its rated distance. Confirm that both ends use the same optical standard and wavelength plan, and allow for connector, splice and patch-panel loss within the stated power budget.

Before deployment, check the host port type, supported data rate and firmware requirements. The 800G interface configuration must match the remote equipment; sharing a Twin-port OSFP IHS/Closed Finned Top housing alone does not make two transceiver types interoperable.

The module is programmed for equipment that recognizes the OSFP800-XDR8-B2 part number. Before shipment, we check EEPROM identification, link establishment and diagnostic readouts, then verify transmit and receiver performance against the stated optical specifications. Host hardware and software revisions can affect third-party module acceptance, so customers can provide the switch model and software release for a compatibility check before ordering.

Quote HT part number OSFP800-XDR8-B2 together with OEM part number OSFP800-XDR8-B2 and the required quantity. Standard modules use our factory label; neutral labels, customer-branded packaging and project-specific compatibility coding are available on request. For mixed-brand installations, select the corresponding brand-specific page instead of assuming one EEPROM version fits every platform.

Each unit undergoes optical performance checks, compatibility verification and visual inspection before packing. Modules are supplied in protective blister trays or anti-static packaging and then cartoned for transport. Custom labels and project packing lists can be added for volume orders.

Standard products normally ship within one to three working days. Worldwide courier, air freight and sea freight options are available, and shipments can also be sent on your own courier account or delivered to an appointed forwarder.